| 摘要 |
<p>A substrate processing system according to the embodiment of the present invention includes: a warpage measuring unit which measures a warpage value for a plurality of units on a substrate including the units; an input unit which inputs the substrate including the units inside; a vacuum molding device which molds the substrate inputted by the input unit according to the unit by referring to the warpage value for the units measured in the warpage measuring unit; a paste printing unit which prints solder paste on the substrate molded by the vacuum molding device; a mounting unit which mounts an electronic device on the substrate printed with the solder paste; and a reflow unit which reflows the substrate mounting the electronic device. Therefore, a mounting yield and bonding reliability between bumps of the substrate and a chip die are improved by improving the warpage (CAW) of the substrate by limitedly forming the warpage (CAW) of the substrate.</p> |
