CHEMICAL MECHANICAL POLISHING PAD WITH POLISHING LAYER AND WINDOW

摘要

A chemical mechanical polishing pad is provided having a polishing layer; and an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: a window prepolymer, and, a window curative system, comprising: at least 5 wt % of a window difunctional curative; at least 5 wt % of a window amine initiated polyol curative; and, 25 to 90 wt % of a window high molecular weight polyol curative.

主权项

1. A chemical mechanical polishing pad, comprising:
a polishing layer having a polishing surface, a base surface and an average thickness, TP-avg, measured in a direction perpendicular to the polishing surface from the polishing surface to the base surface; an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising:
a window prepolymer, wherein the window prepolymer is selected from the group consisting of isocyanate terminated urethane prepolymers having 2 to 6.5 wt % unreacted NCO groups; and,a window curative system, comprising:
at least 5 wt % of a window difunctional curative;at least 5 wt % of a window amine initiated polyol curative having at least one nitrogen atom per molecule and an average of at least three hydroxyl groups per molecule; and,25 to 90 wt % of a window high molecular weight polyol curative having a number average molecular weight, MN, of 2,000 to 100,000 and an average of three to ten hydroxyl groups per molecule.