METHOD FOR CUTTING AND CHAMFERING TEMPERED GLASS

摘要

The present invention relates to a method for cutting and chamfering tempered glass and, more specifically, to a method comprising the steps of: cutting the tempered glass by emitting an infrared laser having a pulse width of 1-20ps and an output of 4-75W; and bringing a heat source, having a temperature not less than an annealing point of the tempered glass and less than an evaporation point thereof, into contact with a cut surface of the tempered glass with an area of 0.001-2.5 mm2, and then chamfering the cut surface by moving the tempered glass at a movement speed of 5-300 mm/sec, thereby quickly cutting the tempered glass without defects and chamfering the tempered glass so as to have a uniform surface and excellent strength.