| 主权项 |
1. A device comprising:
a light emitting diode (LED) die; a substrate with a top surface and a bottom surface, wherein the LED die is disposed on the top surface of the substrate; a landing pad disposed on the top surface of the substrate; a printed circuit board having a conductor, a lower surface, a lower indentation in the lower surface, an upper surface, and an upper indentation in the upper surface, wherein the substrate fits into the lower indentation such that the conductor is electrically coupled through the landing pad to the LED die, and wherein the lower surface of the printed circuit board and the bottom surface of the substrate are substantially coplanar; a highly reflective sheet; a lens with a planar lower surface and a lip, wherein the highly reflective sheet is disposed between the lower surface of the lens and the upper indentation; a double-sided adhesive sheet; and a cover of molded plastic with an inside surface, wherein the adhesive sheet is disposed under the inside surface of the cover and over both the upper surface of the printed circuit board and the lip of the lens. |
