发明名称 |
CAMERA MODULE |
摘要 |
A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module: a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB. |
申请公布号 |
US2015277141(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
US201514737158 |
申请日期 |
2015.06.11 |
申请人 |
LG Innotek Co., Ltd. |
发明人 |
KIM Minsoo;JEONG Seongcheol;HA Taemin;KIM Seonyoung;LEE Junghyun |
分类号 |
G02B27/64;H04N5/225;H04N5/232;G03B13/36 |
主分类号 |
G02B27/64 |
代理机构 |
|
代理人 |
|
主权项 |
1. A camera module, comprising:
a housing unit; a holder module including a bobbin spacedly disposed to the housing unit and an outer blade disposed outside the bobbin; a spring member connecting the bobbin to the outer blade; a wire connecting the spring member to the housing; and a buffering portion disposed near to a connection unit connecting the wire to the spring member or the housing unit. |
地址 |
Seoul KR |