发明名称 CAMERA MODULE
摘要 A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module: a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
申请公布号 US2015277141(A1) 申请公布日期 2015.10.01
申请号 US201514737158 申请日期 2015.06.11
申请人 LG Innotek Co., Ltd. 发明人 KIM Minsoo;JEONG Seongcheol;HA Taemin;KIM Seonyoung;LEE Junghyun
分类号 G02B27/64;H04N5/225;H04N5/232;G03B13/36 主分类号 G02B27/64
代理机构 代理人
主权项 1. A camera module, comprising: a housing unit; a holder module including a bobbin spacedly disposed to the housing unit and an outer blade disposed outside the bobbin; a spring member connecting the bobbin to the outer blade; a wire connecting the spring member to the housing; and a buffering portion disposed near to a connection unit connecting the wire to the spring member or the housing unit.
地址 Seoul KR