HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER MODULE, AND METHOD FOR PRODUCING HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE

摘要

A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface.

主权项

1. A heat-sink-attached-power module substrate which includes a power module substrate in which a circuit layer is arranged on one surface of an insulation layer and a metal layer is arranged on the other surface of the insulation layer, and a heat sink bonded on the metal layer of the power module substrate,
wherein either one of the metal layer and the heat sink is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer and the heat sink are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer and the heat sink, and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer composed of copper or a copper alloy and heat sink composed of copper or a copper alloy in a layered form along the interface.