发明名称 HEAT SINK DEVICE
摘要 A heat sink device includes a thermally conducting base plate configured to be thermally coupled to a heat source. A cover is located substantially opposite the base plate. A plurality of thermally conducting partitions extends laterally from the base plate to the cover. A lateral edge of each partition is in thermal contact with the base plate. The partitions partition a space between base plate and cover into an array of elongated channels with open opposite ends. When the base plate is thermally coupled to a heat source and the open opposite ends of a channel of the array of channels are aligned substantially vertically, a chimney effect air flow is sustained within each channel.
申请公布号 US2015282381(A1) 申请公布日期 2015.10.01
申请号 US201414226835 申请日期 2014.03.27
申请人 COMPULAB LTD. 发明人 YAMPOLSKY Gideon (Genady)
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A heat sink device comprising: a thermally conducting base plate configured to be thermally coupled to a heat source; a cover substantially opposite the base plate; and a plurality of thermally conducting partitions, each partition extending laterally from the base plate to the cover, a lateral edge of that partition being in thermal contact with the base plate, the partitions partitioning a space between base plate and cover into an array of elongated channels with open opposite ends, such that when the base plate is thermally coupled to a heat source and the open opposite ends of a channel of the array of channels are aligned substantially vertically, a chimney effect air flow is sustained within that channel.
地址 Yokneam Elite IL