| 摘要 |
PROBLEM TO BE SOLVED: To enhance heat dissipation effect while maintaining the shape corresponding to the thinning of an electronic apparatus. ! SOLUTION: A heat dissipation device includes a plurality of elementary heat dissipation fins arranged radially to spread from the inlet side toward the outlet side, and having a width that is narrower on the inlet side where heat dissipation wind is blown in than on the outlet side where heat dissipation wind is blown out. The elementary heat dissipation fins are arranged while being deviated in the circulating direction of heat dissipation wind for adjoining elementary heat dissipation fins. In the elementary heat dissipation fins thus arranged, the inlet side corners of respective elementary heat dissipation fins are arranged linearly. ! COPYRIGHT: (C)2016,JPO&INPIT |
