| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board. |
| 申请公布号 |
US2015279759(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201514669491 |
申请日期 |
2015.03.26 |
| 申请人 |
J-DEVICES CORPORATION |
发明人 |
Miyakoshi Takeshi;HOSOYAMADA Sumikazu;KUMAGAYA Yoshikazu;CHIKAI Tomoshige;NAKAMURA Shingo;MATSUBARA Hiroaki;SAKUMOTO Shotaro |
| 分类号 |
H01L23/367;H01L23/00;H01L25/065 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A stacked semiconductor package, comprising:
a first semiconductor package comprising a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package comprising a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; wherein: the first semiconductor package further comprises:
a sealing resin sealing the first semiconductor element;a conductive layer located in contact with the sealing resin; anda thermal via connected to the conductive layer and located on the first circuit board. |
| 地址 |
Oita JP |
