发明名称 |
FILM COATING APPARATUS |
摘要 |
In general, according to one embodiment, a film coating apparatus includes a discharge section configured to discharge a film formation material; a voltage application section configured to apply a voltage to the film formation material, and to set the film formation material at a high potential relative to a film formation object which is subjected to film formation; a mask disposed at a position overlapping a non-coating portion of the film formation object along a direction from the discharge section toward the non-coating portion; and a potential adjusting module configured to make a potential of the mask equal to a potential of the film formation object. |
申请公布号 |
US2015273495(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
US201514638426 |
申请日期 |
2015.03.04 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TOKOH Masahiro |
分类号 |
B05B5/025;B05B15/04;B05B5/16 |
主分类号 |
B05B5/025 |
代理机构 |
|
代理人 |
|
主权项 |
1. A film coating apparatus comprising:
A discharge section configured to discharge a film formation material; a voltage application section configured to apply a voltage to the film formation material, and to set the film formation material at a high potential relative to a film formation object which is subjected to film formation; a mask disposed at a position overlapping a non-coating portion of the film formation object along a direction from the discharge section toward the non-coating portion; and a potential adjusting module configured to make a potential of the mask equal to a potential of the film formation object. |
地址 |
Minato-ku JP |