| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light emission device that can flexibly control the light emission position and light emission shape and has high reliability to the connection between a light emission element and a substrate.SOLUTION: A semiconductor light emission element is press-fitted, from the surface of a cathode electrode layer, into a laminate substrate in which the cathode electrode layer 11 as a first electrode layer, an anode electrode layer 12 as a second electrode layer, and insulating first base substrate 13 and second base substrate 14 are laminated. The cathode electrode layer and the anode electrode layer formed in the form of a mesh. A semiconductor light emission element 16 has a semiconductor laminate comprising a light emission layer, an n-type semiconductor layer and a p-type semiconductor layer, a conical projection portion, an n-electrode, and a p-electrode. The n-electrode is formed at the bottom portion of the semiconductor laminate, and the p-electrode is formed at the tip portion of the projecting portion. The n-electrode and the p-electrode are brought into contact with and electrically connected to the cathode electrode and the anode electrode layer respectively while the semiconductor light emission element is press-fitted in the laminate substrate. |
