发明名称 TEST APPARATUS AND CIRCUIT SUBSTRATE UNIT
摘要 A test apparatus that tests a device under test, comprising first and second test substrates facing each other; test circuits provided respectively on a first substrate surface of the first test substrate facing the second test substrate and a second substrate surface of the second test substrate facing the first test substrate; a first cooling section provided on the first substrate surface of the first test substrate to house the test circuit and to have a cooling medium introduced therein; and a second cooling section provided on the second substrate surface of the second test substrate to house the test circuit and to have a cooling medium introduced therein. The first and second cooling sections include respective contact portions in contact with each other, and each contact portion has a connection opening that connects inside of the first cooling section and inside of the second cooling section to each other.
申请公布号 US2015276858(A1) 申请公布日期 2015.10.01
申请号 US201414226777 申请日期 2014.03.26
申请人 ADVANTEST CORPORATION 发明人 YASUNO Hidehiko;ARAI Chizuru
分类号 G01R31/28 主分类号 G01R31/28
代理机构 代理人
主权项 1. A test apparatus that tests a device under test, comprising: a first test substrate and a second test substrate arranged facing each other; test circuits provided respectively on a first substrate surface of the first test substrate that faces the second test substrate and on a second substrate surface of the second test substrate that faces the first test substrate; a first cooling section that is provided on the first substrate surface of the first test substrate in a manner to house the test circuit, and is to have a cooling medium introduced therein; and a second cooling section that is provided on the second substrate surface of the second test substrate in a manner to house the test circuit, and is to have a cooling medium introduced therein, wherein the first cooling section and the second cooling section include respective contact portions that are in contact with each other, and each contact portion is provided with a connection opening that connects inside of the first cooling section and inside of the second cooling section to each other.
地址 Tokyo JP