| 发明名称 |
ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTOR CHIP PACKAGES |
| 摘要 |
An electromagnetic interference shield is described for semiconductor chip packages. In some embodiments, a package has a semiconductor die. a redistribution layer, a mold compound over the die, a plurality of vias through the mold compound and outside the die to form a shield, and a metal film over the vias. and over the mold compound. |
| 申请公布号 |
US2015279789(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201414229771 |
申请日期 |
2014.03.28 |
| 申请人 |
Mahajan Ravindranath V.;Guzek John S.;Elshebini Adel A.;Deshpande Nitin Ashok |
发明人 |
Mahajan Ravindranath V.;Guzek John S.;Elshebini Adel A.;Deshpande Nitin Ashok |
| 分类号 |
H01L23/552;H01L21/56;H01L23/00 |
主分类号 |
H01L23/552 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A shielded semiconductor device package comprising:
a semiconductor die; a redistribution layer; a mold compound over the die; a plurality of vias through the mold compound and outside the die to form a shield; and a metal film over the vias. and over the mold compound. |
| 地址 |
Tempe AZ US |
