ELECTRODE PAD OF SEMICONDUCTOR CHIP, AND SEMICONDUCTOR CHIP EQUIPPED WITH ELECTRODE PAD

摘要

PROBLEM TO BE SOLVED: To provide an electrode pad of a semiconductor chip that can reduce an area of the semiconductor chip while stable contact between a probe needle for checking electric properties of semiconductor chips and the electrode pad is secured.

SOLUTION: An electrode pad 3a has a rectangular shape tilted to a scribe line 2 where a length in a longitudinal direction is shorter than a length at which a sliding amount of a probe needle 4 can be maintained. The electrode pad is shaped in such a way that the length x of the electrode pad to the direction of an internal circuit of a semiconductor chip is shorter than a length at which a sliding amount of a probe needle 4 can be maintained to enable the contact operation of the probe needle 4 in a diagonal direction with respect to the scribe line 2.

COPYRIGHT: (C)2008,JPO&INPIT