| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency circuit board having a through-hole wherein a solder flow or a solder pad is not generated. SOLUTION: Gold plating 16 applied to a metal plate 11 of the high frequency circuit board is cut and removed on the peripheral part of the through hole 14. The cutting depth of the metal plate 11 is at least the same as the thickness of the gold plating 16, and preferably, the metal plate 11 is cut to depth wherein solder 17 projected from the through hole 14 is not projected from the gold plating surface of the metal plate 11 to form a recess. A method for manufacturing the high frequency circuit board includes a step of forming the through hole on the metal plate 11, a step of applying gold plating to one surface of the metal plate 11 and a step of cutting off the periphery of the through hole 14 on the metal plated surface and exposing a material of the metal plate 11. COPYRIGHT: (C)2008,JPO&INPIT
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