| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the configuration of a backlight panel having a built-in light-emitting diode, and to provide a method of manufacturing the same. <P>SOLUTION: The backlight panel includes a number of arc-shaped dents, a printed circuit board having an electric circuit required for backlighting, and a nano-gold plated layer formed on the printed circuit board and the surfaces of the arc-shaped dents by sputtering. An LED chip is embedded in each of the arc-shaped dents, is fixed at the center of the arc-shaped dent by high frequency welding, and is coated with fluorescent paste composed of a mixture of fluorescent powder and silicon. Further, the arc-shaped dents and the surrounding surfaces of the printed circuit board are covered with a translucent layer made of transparent silicon. <P>COPYRIGHT: (C)2008,JPO&INPIT |
