| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To secure an original area of a device forming region even after finishing grinding and to efficiently perform grinding without reducing the number of obtained semiconductor chips in grinding a rear face where a recess is formed by two-stage grinding for performing finishing grinding after rough grinding. <P>SOLUTION: The recess 1A is formed in a region corresponding to the device forming region 4 at a rear face of a wafer 1 by a rough grinding stone wheel 45 of a rough grinding unit 40A, and a circular convex part 5A at a periphery is formed at the same time. An inner side 5B of the recess 1A is previously ground by a finishing grinding stone wheel 45 of a finishing grinding unit 40B, and a base 4a is ground. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
