| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide conductive particles having a high factor of recovery from deformation due to compression and more specifically from displacement due to high compression, and a method of manufacturing the particles. <P>SOLUTION: The conductive particle comprises a polymer seed particle and a conductive layer coating this polymer seed particle. When the compressive elasticity deformation characteristic K<SB>X</SB>of one conductive particle at a particle diameter displacement of X% is defined by equation (1): K<SB>X</SB>=(3/√2)*(S<SB>X</SB><SP>-3/2</SP>)*(R<SP>-1/2</SP>)*F<SB>X</SB>(where, F<SB>X</SB>is a load (N) required for X% displacement of the conductive particle; S<SB>X</SB>is a quantity of compressive deformation (mm) at X% displacement of the conductive particle; and R is the diameter (mm) of the conductive particle.), the compressive elasticity deformation characteristic K<SB>50</SB>and the diameter recovery factor of the conductive particle at a particle diameter displacement of 50% are 100 to 50,000 N/mm<SP>2</SP>and 30% or more at 20°C respectively. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
