| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which allows heat to dissipate efficiently from the surface of a semiconductor chip to improve the heat dissipation performance of the semiconductor chip. SOLUTION: The semiconductor device includes a tape base material 3, a device hole formed on the tape base material, a plurality of conductive wires 4 which are formed on the tape base material and have portions aligned with the device hole, the semiconductor chip 1 which is mounted by being connected to the conductive wires, and a sealing resin 6a covering the surface of the semiconductor chip. Each conductive wire is connected to the semiconductor chip via a projection electrode 2 formed on an electrode pad on the semiconductor chip. A metal plate 5 having a projection 10 is disposed on the surface side of the semiconductor chip, and a heat dissipating projection electrode 11 is formed on the surface of the semiconductor chip. The projection of the metal plate is connected to the heat dissipating projection electrode of the semiconductor chip to enable heat conduction. COPYRIGHT: (C)2008,JPO&INPIT
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