发明名称 STACKED CAPACITOR AND MANUFACTURING METHOD OF STACKED CAPACITOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a stacked capacitor having low manufacturing cost and capable of remarkably reducing ESL without employing a multi-terminal electrode, and to provide a manufacturing method thereof. <P>SOLUTION: The stacked capacitor 10 has a dielectric blank 12 having a plurality of dielectric layers 12a stacked thereon; an internal layer portion 17 having a first internal layer conductor layer 21 and a second internal layer conductor layer 22 alternately stacked via the dielectric layer 12a; external layer portions 19a, 19b provided adjacently to both the ends of the internal layer portion 17 and respectively having first external layer conductor layers 23 and second external layer conductor layers 25 stacked via the dielectric layer 12a; a first terminal electrode 31 formed on a first side surface 12A; and a second terminal electrode 32 formed on a second side surface 12B. The capacitor has a plurality of pinhole conductor portions 20 for connecting the pair of the first external conductors 23 or the pair of the second external conductors 25 to each other in a region where it overlaps over the pair of the first external conductors 23 or the pair of the second external conductors 25 positioned on the external layer portions 19a, 19b. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008091521(A) 申请公布日期 2008.04.17
申请号 JP20060269071 申请日期 2006.09.29
申请人 TDK CORP 发明人 TOGASHI MASAAKI
分类号 H01G4/30;H01G2/00;H01G4/12;H01G4/232 主分类号 H01G4/30
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