发明名称 SUBSTRATE INSPECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To rapidly and certainly detect a flaw by combining the merits of a plurality of inspection systems in a substrate inspection apparatus for inspecting a substrate for a semiconductor circuit element, a liquid crystal display element, or the like. SOLUTION: The substrate inspection apparatus has a first imaging means for capturing a specular reflection image of light of a plurality of wavelengths irradiated on the inspection surface of a substrate under inspection, a second imaging means for capturing the diffraction image of light of a single wavelength applied on the inspection surface and an inspection means for inspecting the flow of the inspection surface on the basis of the specular reflection image and the diffraction image. Further, the substrate inspection apparatus has a first imaging means for capturing a dark field image of the inspection surface of the substrate under inspection by dark field illumination, a second imaging means for capturing the diffraction image of the light of the single wavelength irradiated on the inspection surface and an inspection means for inspecting the flaw of the inspection surface on the basis of the dark field image and the diffraction image. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008089429(A) 申请公布日期 2008.04.17
申请号 JP20060271159 申请日期 2006.10.02
申请人 NIKON CORP 发明人 TOKUNAGA MASAAKI
分类号 G01N21/956 主分类号 G01N21/956
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