发明名称 RADIATION COMPONENT, PRINTED SUBSTRATE, RADIATION SYSTEM, AND STRUCTURE FOR SUPPORTING PRINTED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a printed substrate capable of effectively emitting heat to an external part, which is radiated from an electronic component, with a simple configuration. SOLUTION: The printed substrate 1 includes a plurality of through-holes 1a in a part with the electronic component 2 mounted thereon, so as to penetrate the printed substrate 1. The projected parts 3b of radiation components 3 are inserted to the through-holes 1a from the rear surface of the printed substrate 1. The distal ends of the projected parts 3b are brought into contact with the electronic component 2. The radiation components 3 are formed of a highly conductive metallic material. The heat radiated from the electronic component 2 is transmitted to the body part 3a on the rear surface of the printed substrate 1 via the projected parts 3b, and emitted from the body part 3a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008091522(A) 申请公布日期 2008.04.17
申请号 JP20060269088 申请日期 2006.09.29
申请人 DIGITAL ELECTRONICS CORP 发明人 IWANO KENJI
分类号 H01L23/40 主分类号 H01L23/40
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