| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the ununiformity of film thickness without damaging a substrate which becomes a base and without increasing the cost. SOLUTION: The film pattern forming apparatus has a first step for film forming a film pattern comprising a transparent conductive film on the base, a second step S1 for measuring the film thickness distribution of the formed film pattern in a plurality of places using at least one of the electric resistance and the transmittance of the film pattern to convert into the film thickness distribution and a third step S6 for applying droplets containing a forming material of the film pattern on the places corresponding to the measured film thickness distribution. COPYRIGHT: (C)2008,JPO&INPIT
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