LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package is provided to obtain high optical extraction efficiency by using an electrical insulating transparent fluid instead of a refractive index matching medium. A package substrate(41) includes a mounting area and a first and second wiring structures having exposed parts. The first and second wiring structures are formed in the mounting region. A light emitting diode(45) includes a first and second electrodes and is loaded in the mounting region so that the first and second electrodes are connected to a first and second bonding pads. A transparent member for cover is loaded in the mounting region of the package substrate. An electrical insulating transparent fluid(47) is used for filling a mounting space of the sealed light emitting diode. The electrical insulating transparent fluid has a refractive index smaller than a refractive index of a component of the light emitting diode.