发明名称 Photocurable resin composition
摘要 A novel photocurable resin composition. The resin composition capable of providing a cured product having excellent mechanical strength, high dimensional accuracy, and excellent toughness. The resin composition capable of providing a cured product with little change in mechanical strength with time. The resin composition capable of forming by fabricating a three-dimensional object which can be used for a long period of time in a humid atmosphere. The composition comprises, (A) a compound represented by the formula (1) illustrated below, (B) a cationic photo-initiator, (C) an ethylenically unsaturated monomer, (D) a radical photo-initiator, and (E) a polyol; <CHEM> wherein R<1> and R<2>, which may be the same or different, individually represent a hydrogen atom, methyl group, ethyl group, isopropyl group, n-butyl group, sec-butyl group, or tert-butyl group, m is an integer from 1-7, and n is an integer from 1-20, provided that when there are two or more groups of R<1> or R<2> present, a plurality of R<1> or R<2> may be either the same or different. <IMAGE>
申请公布号 EP0837366(B1) 申请公布日期 2008.03.19
申请号 EP19970203240 申请日期 1997.10.17
申请人 DSM IP ASSETS B.V.;JAPAN SYNTHETIC RUBBER CO., LTD.;JAPAN FINE COATINGS CO., LTD. 发明人 YAMAMURA, TETSUYA;WATANABE, TSUYOSHI;UKACHI, TAKASHI;TAKEUCHI, AKIRA
分类号 G03F7/00;G03F7/004;C08F2/50;C08L63/00;G03C9/08;G03F7/027;G03F7/028;G03F7/029;G03F7/038 主分类号 G03F7/00
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