| 摘要 |
To provide an optical module capable of improving the workability for a circuit substrate, in the rear of a shield case ( 22 ), a pressing portion ( 27 ) for holding an FOT ( 6 ) is formed to press a back surface of a package portion ( 9 ) of the FOT ( 6 ). In the rear of the shield case ( 22 ), a stress countermeasure portion ( 28 ) is formed to distribute or mitigate a stress occurring due to deformation and displacement of the pressing portion ( 27 ). The stress countermeasure portion ( 28 ) is formed between the pressing portion ( 27 ) and a substrate connection portion ( 16 ). The stress countermeasure portion ( 28 ) is formed in the vicinity of the pressing portion ( 27 ). In a small space between a base (or bend portion) of the pressing portion ( 27 ) and the stress countermeasure portion ( 28 ), the force in a twist direction acts due to the occurred stress. This force is distributed or absorbed according to presence and shape of the stress countermeasure portion ( 28 ).
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