| 摘要 |
The invention provides a reusable precision fabricated silicon mold comprising a mold made of silicon which comprises a desired pattern of physical features cavities etched into the mold to transfer a patter on bumps to a semiconductor wafer, e.g., computer chip, semiconductor device, silicon on insulator device, etc.; an aperture etched into the mold adapted to allow gases to escape but does not to allow a solder to escape during the process of transferring solder bumps to a chip; a protective oxide or nitride on the mold; alignment marks adapted to properly align the mold with a semiconductor wafer; an organic release material on the mold adapted to release the mold from the semiconductor wafer, wherein the mold precisely defines a conductive adhesive material volume for interconnects on the semiconductor wafer.
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