发明名称 |
PRESSURE SENSOR WITH SILICON FRIT BONDED CAP |
摘要 |
A pressure sensor apparatus and method that incorporates a silicon frit bonded cap. The pressure sensor includes a silicon sensor wafer with diaphragms at a bottom surface thereof, a silicon cap wafer mounted on the topside of each sensor wafer, a plurality of silicon sensor die formed on the sensor wafer, a silicon cap wafer etched to create a plurality of reference cavities on the topside of the diaphragm, a thin glass frit to form a wafer-to-wafer bond between the sensor wafer and cap wafer. Sensing devices such as semiconductor die/sensor, peizoresistors, can be used to sense the pressure. The wafer-to-wafer frit bonding improves the output signal drift and the thermal performance of the pressure sensor minimizes the thermal mismatch created by anodic bonded glass wafers. |
申请公布号 |
WO2007079454(A3) |
申请公布日期 |
2007.12.13 |
申请号 |
WO2007US00188 |
申请日期 |
2007.01.04 |
申请人 |
HONEYWELL INTERNATIONAL INC.;STEWART, CARL, E.;MORALES, GILBERTO |
发明人 |
STEWART, CARL, E.;MORALES, GILBERTO |
分类号 |
G01L9/00 |
主分类号 |
G01L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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