| 摘要 |
<P>PROBLEM TO BE SOLVED: To handle an electronic component provided with its connection surface directed upwardly and an electronic component provided with its connection surface directed downwardly together by one apparatus, and to mount them with high precision and high speed in such a manner that the connected surfaces face the surfaces of the substrate. <P>SOLUTION: The method of mounting an electronic component includes steps of positioning a substrate 2 on a positioning section in an X direction; transporting an electronic component 3, which is supplied while orienting upward, on one side of a Y direction orthogonal to the X direction of the positioning section, and supplying the electronic component 3 to a first component supplying position A after being reversed upside down; supplying an electronic component 4, which is supplied on the other side of the Y direction while orienting downward, to a second component supplying position B; transporting the electronic component 3 positioned on the first component supplying position A toward the Y direction by a first mounting head; and transporting the electronic component 4 supplied on the second component supplying position B toward the Y direction by a second mounting head, and mounting the electronic component 4 on an arbitrary position in the Y direction of the substrate 2. These first and second mounting steps perform the different operation of the first and second mounting head, respectively. In the second mounting head, a plurality of chip components is held, and arbitrary chip component is selectively mounted. <P>COPYRIGHT: (C)2008,JPO&INPIT |
