BALL-LIMITING METALLURGIES, SOLDER BUMP COMPOSITIONS USED THEREWITH, PACKAGES ASSEMBLED THEREBY, AND METHODS OF ASSEMBLING SAME

摘要

A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that withstands higher temperature reflows and other higher temperature processes.