发明名称 |
POWER MODULE AND AIR CONDITIONER |
摘要 |
An efficient heat diffusing structure comprising a power module having a mounting substrate that has a high thermal conduction efficiency. The mounting substrate is comprised of a mounting surface on which an electric power circuit for controlling electric power is mounted, and a heat dissipating surface that has a corrugated section formed thereon that serves to dissipate heat. This heat diffusing structure allows the size of the device to be reduced, and also allows costs to be reduced. |
申请公布号 |
EP1406303(A4) |
申请公布日期 |
2007.12.12 |
申请号 |
EP20020741385 |
申请日期 |
2002.07.01 |
申请人 |
DAIKIN INDUSTRIES, LTD. |
发明人 |
IIDA, MASAKAZU;EHIRA, SHINJI |
分类号 |
H01L23/367;H01L23/433;H05K1/02;H05K1/03;H05K1/14;H05K3/00;H05K3/28;H05K3/34;H05K3/36 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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