| 摘要 |
The invention relates to a semiconductor switching module (1) comprising a power semiconductor element (210, 310) with a planar configuration and a module housing (220, 320) that completely surrounds at least one face (10) of the power semiconductor element (210, 310). At least one opening (220', 220'', 320', 320'') is provided at two respective, essentially opposing points of the module housing (220, 320) in such a way that to cool the power semiconductor component (210, 310), an air stream flows over the face (10) of the power semiconductor element (210, 310) that is surrounded by the module housing (220, 320). |
