发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing technology which prevents scratch, peeling, dishing, and erosion, and does not need complex cleaning process and complex abrasive powder supply/disposal apparatus, to reduce cost of expendable supplies such as abrasive powder, polishing cloth. <P>SOLUTION: A metal film 21 formed on an insulating film 23 having grooves is polished with the polishing cloth by using a polishing solution which includes a substance making an oxidizer and an oxide water-soluble, does not include abrasive grains substantially, and polish solution that shows a property of a corrosion condition for a metal film. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007243206(A) 申请公布日期 2007.09.20
申请号 JP20070104390 申请日期 2007.04.12
申请人 HITACHI LTD 发明人 KONDO SEIICHI;HONMA YOSHIO;SAKUMA NORIYUKI;TAKEDA KENICHI;HINODE KENJI
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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