发明名称 PATTERN FORMING METHOD, DEVICE, METHOD OF MANUFACTURING DEVICE, ELECTROPTICAL APPARATUS AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To solve the problem wherein a function solution does not wet at large a fine line section where a liquid drop is not jetted when a hole such as a contact hole or a step is provided thereon, when a segment region is provided with a partition and a liquid drop is arranged by a liquid drop jetting method. SOLUTION: A wide portion to be provided for liquid drop jetting matches a portion having a hole such as a contact hole or a step difference, and the reliability of vertical conduction is improved in the case of the contact hole. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007242911(A) 申请公布日期 2007.09.20
申请号 JP20060063703 申请日期 2006.03.09
申请人 SEIKO EPSON CORP 发明人 SHIOTANI ETSUKO
分类号 H01L21/3205;H01L21/336;H01L21/768;H01L23/52;H01L23/522;H01L29/786;H01L51/50;H05B33/10;H05B33/12;H05B33/22 主分类号 H01L21/3205
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