发明名称 |
PATTERN FORMING METHOD, DEVICE, METHOD OF MANUFACTURING DEVICE, ELECTROPTICAL APPARATUS AND ELECTRONIC EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein a function solution does not wet at large a fine line section where a liquid drop is not jetted when a hole such as a contact hole or a step is provided thereon, when a segment region is provided with a partition and a liquid drop is arranged by a liquid drop jetting method. SOLUTION: A wide portion to be provided for liquid drop jetting matches a portion having a hole such as a contact hole or a step difference, and the reliability of vertical conduction is improved in the case of the contact hole. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007242911(A) |
申请公布日期 |
2007.09.20 |
申请号 |
JP20060063703 |
申请日期 |
2006.03.09 |
申请人 |
SEIKO EPSON CORP |
发明人 |
SHIOTANI ETSUKO |
分类号 |
H01L21/3205;H01L21/336;H01L21/768;H01L23/52;H01L23/522;H01L29/786;H01L51/50;H05B33/10;H05B33/12;H05B33/22 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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