| 摘要 |
PROBLEM TO BE SOLVED: To provide a fluoroscopic inspection device of a semiconductor wafer easy of configuration, capable of shortening a detection time without requiring a long time in the transfer of data and deteriorating resolving power and especially suitable for use when a large amount of semiconductor wafers are rapidly inspected to achieve a mass production. SOLUTION: The fluoroscopic inspection device of the semiconductor wafer includes a radiation source 1, a rotary operation means 3 for holding the semiconductor wafer 101 to rotationally operate the same, a line sensor 4 for detecting the dose of radiation transmitted through the semiconductor wafer 101 installed so that the arrangement direction of a sensing part is set to an almost diametric direction with respect to the rotary locus of the semiconductor wafer 101 and an addition means 6 for allowing the radiation intensity data detected by the line sensor 4 to correspond to the angle-of-rotation position of the semiconductor wafer 101 to successively add the same at every sensing part. The position of the abnormal place of the radiation transmittance in the semiconductor wafer 101 is specified on the basis of the radiation intensity data loaded by the addition means 6. COPYRIGHT: (C)2007,JPO&INPIT
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