| 摘要 |
In a method and apparatus for bonding an electronic element to a substrate, a laser beam is generated, pressure is applied to the substrate, a connecting medium, and an electronic element, which are stacked, and the electronic element is bonded to the substrate through heat fusion of the connecting medium by fusing the connecting medium by irradiating the laser beam to the substrate and the electronic element while applying pressure to the substrate, the connecting medium, and the electronic element. The laser beam of a line type or an area type has uniform quality through use of a homogenizer. The laser beam is output in a continuity mode at an initial stage, and is output in a pulse mode at a fusing stage. |
