| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition excellent in PEB (post exposure bake) sensitivity and resolution, and a resist pattern forming method. <P>SOLUTION: The positive resist composition contains a resin component (A) having an acid-dissociable dissolution inhibiting group, of which the alkali solubility increases under the action of an acid and an acid generator component (B) which generates an acid upon exposure to light, wherein the resin component (A) comprises a constitutional unit (a0) represented by general formula (a0-1), wherein R denotes H, halogen, a lower alkyl group or a halogenated lower alkyl group; and n' denotes an integer of 1 or 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
