发明名称 COOLING/HEATING DEVICE AND MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling/heating device and a mounting device capable of simplifying a system having both of heating and cooling functions, significantly reducing failure, and further reducing power consumption. SOLUTION: This mounting device 10 comprises a wafer chuck 11 and the cooling/heating device 12, the cooling/heating device 12 comprises a Stirling heat engine 20 for cooling and heating cooling liquid of a second cooling liquid circulation passage 17, and the Stirling heat engine 20 has first and second pistons 23, 24 respectively reciprocated in first and second cylinder chambers 21A, 22A with phase difference of approximately 90°, for expanding and compressing a working medium, and a driving mechanism 25 for driving the first and second pistons 23, 24 in the forward and backward directions. The working medium is expanded in the first cylinder chamber 21A and cools the cooling liquid by the driving in the forward direction, of the first and second pistons 23, 24, and the working medium is compressed in the first cylinder chamber 21A and heats the cooling liquid by the driving in the backward direction, of the first and second pistons 23, 24. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007240035(A) 申请公布日期 2007.09.20
申请号 JP20060060361 申请日期 2006.03.06
申请人 TOKYO ELECTRON LTD 发明人 HATTA MASATAKA
分类号 F25B9/14 主分类号 F25B9/14
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