| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board having improved conductive characteristics. SOLUTION: In the manufacturing method of a wiring board, a first substrate 10 where a first metal is exposed is connected to a second substrate 12 where a second metal having larger ionization tendency than that of the first metal is exposed by a lead 16, and the first and second substrates are dipped into an electroless plating liquid 14 having a second metal and a reducing agent, thus depositing the second metal on the first substrate for forming a metal layer. COPYRIGHT: (C)2007,JPO&INPIT
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