LIGHT EMITTING DEVICE PACKAGE AND FABRICATING METHOD THEREOF

摘要

A light emitting device package and its manufacturing method are provided to downsize the package by installing a protective circuit in a submount using a diffusion layer. One ends of a pair of lead are enclosed by package bodies(110a,110b), and a heat sink(120) is inserted into a through-hole of the package body. A submount(130) has upper and lower surfaces, and a mounting groove formed on a center portion of the upper surface. A light emitting element(131) is flip-chip-bonded to the upper portions of a pair of electrodes formed on the submount. A conductive wire(150) electrically connects the electrodes with the leads. The light emitting element, the submount and the conductive wire are enclosed by moldings(160,180).