发明名称 |
Polishing composition and polishing method |
摘要 |
A polishing composition contains silica abrasive grains and an iodine compound. The silica abrasive grains exhibit a negative zeta potential in the polishing composition. The silica abrasive grains have an average primary particle size of 30 nm or smaller, and the polishing composition has a pH of 4 or lower. The polishing composition is suitable for polishing a polysilicon film and a silicon nitride film.
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申请公布号 |
US2007202703(A1) |
申请公布日期 |
2007.08.30 |
申请号 |
US20070711234 |
申请日期 |
2007.02.27 |
申请人 |
SHIMIZU MIKIKAZU;NAKAJIMA TAKEHIKO |
发明人 |
SHIMIZU MIKIKAZU;NAKAJIMA TAKEHIKO |
分类号 |
H01L21/461;B24B37/00;B24D3/02;B82Y10/00;B82Y99/00;C09K3/14;H01L21/304 |
主分类号 |
H01L21/461 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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