| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of preventing an amount of solder from being reduced until connection failure occurs even when a solder bump is remelted in a heat treatment process such as a reflow, after a semiconductor component is packaged using the solder bump and underfill resin is injected to the circumference of the solder bump. <P>SOLUTION: In the printed circuit board, a solder resist film for preventing solder adhesion is formed around a land electrode of the printed circuit board made of a metal material. Further, a portion on which the solder resist film is not applied is provided around the solder resist film. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
