| 摘要 |
PROBLEM TO BE SOLVED: To provide a fixed carrier capable of restraining a circumference of a semiconductor wafer from partly oscillating and exfoliating in a back grinding process and restraining a polishing solution from invading even when the semiconductor wafer is shifted in some degree when it is set. SOLUTION: The fixed carrier comprises a substrate 2 with rigidity; a concave hole 3 provided in the surface of the substrate 2; a plurality of support protrusions 5 arranged in the concave hole 3; a deformable adhesive layer 6 supported by the plurality of support protrusions 5, while covering the concave hole 3 for removably adhesively holding the semiconductor wafer W; and an exhaust passage 7 for guiding air in the concave hole 3 covered with the adhesive layer 6 to the outside, based on the drive of a vacuum pump 8. A circumference 4 of the concave hole 3 and the circumference of the semiconductor wafer W are opposed via the adhesive layer 6, and a restriction body 10 is provided in an inner surface of the circumference 4 of the concave hole 3 for restricting the oscillation of the circumference of the semiconductor wafer W. COPYRIGHT: (C)2007,JPO&INPIT
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