| 摘要 |
A heat sink ( 10 ) for a semiconductor package ( 38 ) includes a top surface ( 12 ) having a recessed hole ( 16 ) at its center. A sidewall ( 14 ) formed around the top surface ( 12 ) of the heat sink ( 10 ) has gaps ( 18 ) formed in the sidewall ( 14 ). An air vent ( 22 ) is formed at a corner of the heat sink ( 10 ). The heat sink ( 10 ) is used for center gate molding. Mold compound ( 24 ) enters the recessed hole ( 16 ), covers an IC die 30 , and exits via the gaps ( 18 ). During mold injection, air escapes through the air vent ( 22 ).
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