| 摘要 |
A multi-chip package is provided to improve reliability and productivity of a product by preventing a wire sweeping effect due to use of a long wire. A ball land(205) is formed on a bottom surface of a substrate(200). A first semiconductor chip(210) is attached on an upper surface of the substrate. A first bonding wire(230a) is used for connecting electrically the first semiconductor chip and the substrate. A first epoxy molding compound(240a) is formed on the substrate to cover the first semiconductor chip and the first bonding wire. A second semiconductor chip(220) is larger than the first semiconductor chip and is attached on the first epoxy molding compound. A second bonding wire(230b) is used for connecting electrically the second semiconductor chip and the substrate. A second epoxy molding compound(240b) is formed on the substrate to cover the first epoxy molding compound, the second semiconductor chip, and the second bonding wire. |
