| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the bonding reliability between a terminal pad and solder by enhancing the tolerance to thermal stress in a bonding portion for bonding the terminal pad and the solder. <P>SOLUTION: The bonding structure of the terminal pad and solder comprises the terminal pad 120 formed on a base 105, the solder 240, and a reaction product 260 of the constituent component of the terminal pad with a Zn-based material 230 which is interposed between the terminal pad and the solder. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
