| 摘要 |
A small-sized, light-weight, low-cost power semiconductor device with excellent productivity and vibration resistance is obtained. A mold resin casing ( 1 ) is made of a thermosetting resin, such as epoxy resin, and has a top surface ( 1 T) and a bottom surface ( 1 B). A through hole ( 2 ) is formed in a non-peripheral portion (in this example, approximately in the center) of the mold resin casing ( 1 ) to pass through between the top surface ( 1 T) and the bottom surface ( 1 B). Electrodes ( 3 N, 3 P, 4 a , 4 b) have their first ends projected from sides of the mold resin casing ( 1 ). The bottom surface ( 5 B) of a heat spreader ( 5 ) is exposed in the bottom surface ( 1 B) of the mold resin casing ( 1 ). The heat spreader ( 5 ) has an opening ( 6 ) formed around the through hole ( 2 ). |
