发明名称 METHOD OF MANUFACTURING MULTILAYER WIRING BOARD, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring technology which achieves wiring using a carbon nanotube by a simple method without using an expensive etching apparatus or the like. <P>SOLUTION: After forming a lower layer wiring 12 comprising Al or the like on the surface of a substrate 11 (refer to Figure 2(a)), a catalyst metal containing layer 14 is formed at a place where a carbon nanotube 16 should be arranged of the lower layer wiring 12. Then, the carbon nanotube 16 is formed on the catalyst metal containing layer 14 by a thermal CVD method or the like, and is selectively grown in a vertical direction from the catalyst metal containing layer 14 (refer to Figure 2(b)). Furthermore, an interlayer insulating film 13 is formed on the substrate 11 with the carbon nanotube 16 grown selectively by using a coating method (refer to Figure 2(c)). After that, there is formed an upper wiring layer 15 covering the upper end of the carbon nanotube 16 and the interlayer insulating film 13 by a sputtering method or the like (refer to Figure 2(d)). <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006344906(A) 申请公布日期 2006.12.21
申请号 JP20050171380 申请日期 2005.06.10
申请人 SEIKO EPSON CORP 发明人 YUDASAKA KAZUO
分类号 H01L21/3205;H01L21/28;H01L21/336;H01L21/768;H01L23/52;H01L29/06;H01L29/78 主分类号 H01L21/3205
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