| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component mounting film carrier tape which can be formed comparatively easily with improved reliability, an electroplating method and an electroplating apparatus thereof. SOLUTION: The electronic component mounting film carrier tape has a wiring pattern 13 of a conductive layer 12, provided on the surface of a continuous insulation film 11 and a plating layer 19 formed on the conductive layer 12 and an electronic component 15 mounted on the wiring pattern 13 is bonded via the plating layer 19. The widthwise crystal grain size variation of the plating layer 19 is set within±50% of the specified value.</p> |
