发明名称 |
Porous film, composition and manufacturing method, interlayer dielectric film, and semiconductor device |
摘要 |
A porous film-forming composition comprising (A) a curable silicone resin having a Mn of at least 100, (B) a micelle-forming surfactant, and (C) a compound which generates an acid upon pyrolysis remains stable during storage. The composition is coated and heat treated to form a porous film which has flatness, uniformity, a low dielectric constant and a high mechanical strength so that it is best suited as an interlayer dielectric film in the fabrication of semiconductor devices.
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申请公布号 |
US2006220253(A1) |
申请公布日期 |
2006.10.05 |
申请号 |
US20060446160 |
申请日期 |
2006.06.05 |
申请人 |
HAMADA YOSHITAKA;YAGIHASHI FUJIO;NAKAGAWA HIDEO;SASAO MASARU |
发明人 |
HAMADA YOSHITAKA;YAGIHASHI FUJIO;NAKAGAWA HIDEO;SASAO MASARU |
分类号 |
C08K5/00;H01L23/52;C08J9/00;C08L83/02;C09D183/02;H01B3/00;H01B3/46;H01L21/312;H01L21/316;H01L21/768;H01L23/48;H01L29/40 |
主分类号 |
C08K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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